Structural Analysis Software(cad) - List of Manufacturers, Suppliers, Companies and Products

Structural Analysis Software Product List

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AUTODESK(R)SIMULATION MECHANICAL

Achieve high-precision analysis with Autodesk Simulation Mechanical's advanced analysis capabilities and automatic hexahedral mesher!

Autodesk Simulation Mechanical is a structural analysis package with a wide range of analysis capabilities. It can perform static stress analysis with linear and nonlinear material models, mechanical event simulation (MES: nonlinear dynamic analysis), linear dynamic analysis, steady-state and transient heat conduction, electrostatic analysis, and multiphysics (coupled analysis). As part of the family of CAE software, it includes resin flow analysis Moldflow and thermal-fluid analysis CFD, allowing for coupling between resin flow-structure and fluid-structure. Additionally, the cloud CAE service Sim360 enables cost-effective use of Autodesk Simulation family products whenever needed.

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[Case Study] Analysis of Complex Shape Models - Reducing Labor Costs -

"VOXELCON" is a structural analysis software that directly models STL data from CT and CAD for analysis and measurement purposes.

When creating an analysis model by mesh partitioning from a detailed CAD model created as design data, the following issues can be noted: - The number of elements becomes enormous, leading to high computational costs. - Mesh partitioning is difficult and requires the tips and techniques of experienced users. Additionally, the analysis results depend on the mesh partitioning. - In some cases, automatic element partitioning is not possible. However, even if you try to analyze using a simplified shape... - The effort required for simplification is significant. - Evaluating the impact of simplification on analysis accuracy is cumbersome. These issues can be resolved by VOXELCON's voxel mesh generation technology. Even complex shapes can be easily converted into analysis models, reducing the man-hours required for analysis. *For more details, please refer to the related links or feel free to contact us.

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[Case Study] Stress Analysis of a Crankshaft through Reverse Engineering

"VOXELCON" is a structural analysis software that directly models STL data from CT and CAD for analysis and measurement purposes.

Model Creation and Structural Analysis from CT Images We will introduce an example of reverse engineering that measures the shape of a product (actual item) and uses it for direct analysis. Generally, creating a model for analysis from X-ray CT scan images requires a very labor-intensive process of generating a CAD model from the extracted surface. However, at VOXELCON, we can directly create a surface model from the image data of the X-ray CT scanner and apply boundary conditions directly on the surface model, allowing for voxel analysis without additional steps. This significantly reduces the man-hours required for reverse engineering. Here, we will present an example of creating a model from artificially generated tomographic images, simulating the tomographic images from an X-ray CT scanner, and performing static stress analysis. *For more details, please refer to the related links or feel free to contact us.*

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Introduction to Desktop Structural Analysis Program

Creating geometry and analysis models, executing analysis, and post-processing, all realized in one software on one PC!!

【Features】 ○ A structural analysis solution that combines the pre- and post-processor "Femap" with the analysis solver "NX Nastran" ○ A series of tasks for finite element analysis, including the creation of analysis models from 3D-CAD generated shape data, analysis, and result display, can be accomplished with a single software on one PC ○ Operates on PCs equipped with Windows, allowing work in a familiar environment ○ High operability ○ Easy-to-implement pricing ○ Supports 64-bit environments ○ Capable of handling large-scale analyses ◎ For more detailed information, please refer to the catalog or contact us directly.

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[Example] Analysis of Warping in Electronic Circuit Boards

"VOXELCON" is a structural analysis software that directly models STL data from CT and CAD for analysis and measurement purposes.

At VOXELCON, we perform thermal stress analysis using the temperature distribution from steady-state heat conduction analysis as a thermal load, allowing for easy weakly coupled analysis of steady-state heat conduction and thermal stress. Here, we will introduce an example of warpage analysis of an electronic substrate using a simple model. *For more details, please refer to the related links or feel free to contact us.*

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[Example] Model creation and structural analysis in bioengineering.

"VOXELCON" is a structural analysis software that directly models STL data from CT and CAD for analysis and measurement purposes.

In the field of bioengineering, since there is no design data available, it is necessary to measure the actual object and create an analysis model. By using image-based analysis supported by VOXELCON, modeling can be performed from CT scan images of the actual object, allowing for faithful modeling that eliminates human error and significantly reduces the effort required for modeling. *For more details, please refer to the related links or feel free to contact us.*

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[Example] Equivalent permeability coefficient and micro flow velocity distribution of porous media.

"VOXELCON" is a structural analysis software that directly models STL data from CT and CAD for analysis and measurement purposes.

With the increasing use of composite materials and porous materials, the importance of evaluating the properties of their microstructures is growing. In this example, we will introduce the calculation of the equivalent permeability coefficient and micro velocity distribution of a porous body as an example of evaluating the flow characteristics of microstructures using the homogenization method of VOXELCON. *For more details, please refer to the related links or feel free to contact us.*

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Image-based structural analysis software 'VOXELCON'

Easy modeling of any shape! 3D editing, analysis, measurement, and material property calculation of CT images based on images.

"VOXELCON" is a powerful image-based structural analysis software that directly models and utilizes CT images obtained from physical objects and STL data from CAD for analysis and measurement. It is equipped with a variety of reverse engineering functions as structural analysis and measurement features. It is effective in various scenarios, from cast products to composite materials, and from the design stage to quality control. Additionally, voxel segmentation is ultra-fast, capable of creating a mesh of 100 million voxels in just a few seconds, and is extremely robust, resulting in very few failures. 【Features】 ■ Direct use of physical data ■ Various reverse engineering functions ■ Ultra-fast and robust voxel segmentation ■ Large-scale solver included ■ Cutting-edge multi-scale analysis *For more details, please refer to the related links or feel free to contact us.

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[Example] Calculation of Equivalent Stiffness of Sandwich Structural Panels

"VOXELCON" is a structural analysis software that directly models STL data from CT and CAD for analysis and measurement purposes.

The sandwich structure, which consists of a core material sandwiched between surface panels to form a unified structure, is widely used in various fields as it offers a lightweight design with high bending stiffness. However, in cases where the core is composed of multiple materials rather than a single material, the equivalent properties of the sandwich structure cannot be derived from simple laminate theory. In this example, we will use VOXELCON's homogenization analysis function to calculate the equivalent property values of a core made of composite materials, and we will introduce an example of bending analysis of the sandwich structure using a simplified model based on the obtained material property values. *For more details, please refer to the related links or feel free to contact us.*

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[Example] Topology optimization of large-scale models

"VOXELCON" is a structural analysis software that directly models STL data from CT and CAD for analysis and measurement purposes.

VOXELCON is equipped with topology optimization using the level set method. In this topology optimization, a target volume is set, and a shape is sought that maximizes stiffness (minimizes displacement at load points) under that volume constraint. Since structural optimization involves repeated structural analysis, the computation time can be very long. Additionally, the structural analysis specialized for voxels is characterized by good parallelization efficiency and low memory consumption, allowing for analysis of large-scale problems in a realistic time frame. The topology optimization feature also supports parallel execution on GPUs, so we will also introduce the computation time. *For more details, please refer to the related links or feel free to contact us.*

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[Example] Evaluation of macro physical properties using actual data

"VOXELCON" is a structural analysis software that directly models STL data from CT and CAD for analysis and measurement purposes.

In material design, investigating the macroscopic mechanical properties of porous materials such as ceramics and foamed metals, as well as composite materials represented by FRP, is extremely important. When actual samples are available, it is generally possible to measure them through experiments; however, depending on the properties of the materials and the condition of the samples, experiments may not always be easy. Here, we will introduce an example of calculating the macroscopic physical properties of a sample by analyzing the tomographic images obtained from scanning the actual sample with a micro X-ray CT scanner, using VOXELCON's image-based modeling and homogenization analysis functions. Note: The physical properties of the original materials constituting the porous materials and composite materials are assumed to be obtained in advance. *For more details, please refer to the related links or feel free to contact us.

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CAE Technology Research Conference 2016 (Free Participation Fee)

The keynote speech will feature hot topics on the science of sports and presentations on fire simulation research.

CAE Utilization Technology Research Conference 2016 "Let's Talk about CAE in Kudanshita!" / "6th DADiSP Utilization Technology Research Conference" The CAE Utilization Technology Research Conference is celebrating its 6th year since the DADiSP Utilization Technology Research Conference. We have many user case studies planned. This event is packed with useful and up-to-date information on cloud CAE, composite materials, optimization, and more, which you won't hear elsewhere. ============================= ● Date and Time: August 5, 2016 (Friday) 10:00 AM - 5:30 PM (Networking event from 5:30 PM) ● Capacity: 80 participants ● Venue: Hotel Grand Palace 1-1-1 Iidabashi, Chiyoda-ku, Tokyo (• 1-minute walk from Kudanshita Station on the Tokyo Metro Tozai Line, Exit 7 (Fujimi Exit)) ● Registration: http://www.cae-sc.com/events/cae-conf-2016.html ■ Organized by: CAE Solutions Co., Ltd.

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